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Heating block for semiconductor chip wire bonding machine - has inner heating stage and chip heating stage at two different temps.
Heating block for semiconductor chip wire bonding machine - has inner heating stage and chip heating stage at two different temps.
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机译:半导体芯片引线键合机的加热块-在两个不同的温度下具有内部加热阶段和芯片加热阶段。
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摘要
The heating block has an inner heating stage (12), for bonding one end of each wire with each inner conductor of a lead frame. A chip heating stage (13) bonds the opposite ends of the wires to a semiconductor chip. The inner heating stage is heated to a higher temp. than the chip heating stage. Pref. a differential heating device (30) has an opening (16) in the centre of the inner heating stage into which the chip heating stage is fitted. The latter is made of a material with a lower thermal conductivity than the heating block (10) for the inner heating stage. ADVANTAGE - Prevents damage to semiconductor chip during bonding.
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