Heat pipe radiator for large scale integrated circuit - has cooling plate and heat conduction plate cooperating with evaporation and condensation zones of heat pipe

摘要

The heat pipe radiator has a cooling plate (4) on the evaporation side of a heat pipe (1) and a flat heat conduction plate (10) at the condensation side, the heat generating electronic components lying in contact with the cooling plate (4). A thin plate with corrugations defining a series of heat radiation ribs (11) lies on each side of the heat conduction plate. The evaporation and condensation zones of the heat conduction pipe (1) both have a rectangular cross-section, the condensation zone pref. having a greater side-to-width ratio. ADVANTAGE - Allows dissipation of large quantity of latent heat with high heat dissipation rate.