flussmittelzusammensetzung and procedures to reduce the zinngehalts in lead tin lotverbindungen.

摘要

A technique for soldering is provided wherein the solder contains a nominal amount of 4 to 5% tin and the remainder lead. A solder flux is utilized which incorporates a lead compound, such as lead acetate. When the solder and flux is heated, a redox reaction will take place in which the lead ions in the flux will replace the alloyed tin in the solder, thereby reducing the tin content of the solder, whereby the ductility of the solder joint is improved.