首页>
外国专利>
Metallized bag with improved interlayer adhesion for static protection of electronic components
Metallized bag with improved interlayer adhesion for static protection of electronic components
展开▼
机译:具有改善的层间附着力的金属化袋,可对电子组件进行静电保护
展开▼
页面导航
摘要
著录项
相似文献
摘要
A flexible sheet material and bags made therefrom for packaging electrostatically sensitive items such as electronic circuit boards. The sheet has a metal layer that is adhesively laminated to an antistatic polymeric layer, the instant bag being of improved metal layer to antistatic layer adhesion. The metal outer surface of the bag has a high non-conductive surface resistivity greater than or equal to 10.sup.8 ohms/square, yet the bag protects the packaged item from static voltage by preventing the capacitive coupling of the voltage through the bag to the item packaged therein.
展开▼