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Method of making electrically erasable and electrically programmable memory cell with extended cycling endurance

机译:具有延长的循环寿命的电可擦除和电可编程存储单元的制造方法

摘要

A method of forming a doped region within a monocrystalline silicon layer of an integrated circuit having an electrically erasable and electrically programmable memory device on a semiconductor substrate, wherein the doped region lies within a channel region near a drain region, but does not lie within a source region. After a patterned layer is formed over the channel region, the substrate is doped by ion implantation with a first dopant at a tilt angle no less than a minimum tilt angle and at about a predetermined azimuthal angle, such that a significant number of ions enter a drain region and a channel region near the drain region and substantially no ions enter a source region. The first dopant is the same dopant type as the monocrystalline silicon layer dopant. The drain region is masked. The source region is doped with a second dopant. The second dopant is an opposite dopant type as the monocrystalline silicon layer dopant. The source region and the drain region are doped with a third dopant. The third dopant is the same dopant type as the second dopant. The third dopant dose is heavier than the first dopant dose, and the second dopant diffusion coefficient is greater than the third dopant diffusion coefficient.
机译:一种在半导体衬底上具有电可擦除和电可编程存储器件的集成电路的单晶硅层内形成掺杂区的方法,其中该掺杂区位于漏极区附近的沟道区内,但不位于漏极区内。源区域。在沟道区上方形成图案化层之后,通过离子注入以不小于最小倾斜角且大约为预定方位角的第一掺杂剂对衬底进行掺杂,使得大量离子进入硅中。漏极区和靠近漏极区的沟道区,基本上没有离子进入源极区。第一掺杂剂是与单晶硅层掺杂剂相同的掺杂剂类型。漏极区被掩蔽。源极区域掺杂有第二掺杂剂。第二掺杂剂是与单晶硅层掺杂剂相反的掺杂剂类型。源极区和漏极区掺杂有第三掺杂剂。第三掺杂剂与第二掺杂剂类型相同。第三掺杂剂剂量比第一掺杂剂剂量重,并且第二掺杂剂扩散系数大于第三掺杂剂扩散系数。

著录项

  • 公开/公告号US5190887A

    专利类型

  • 公开/公告日1993-03-02

    原文格式PDF

  • 申请/专利权人 INTEL CORPORATION;

    申请/专利号US19910815946

  • 发明设计人 DANIEL N. TANG;GREGORY E. ATWOOD;

    申请日1991-12-30

  • 分类号H01L21/70;

  • 国家 US

  • 入库时间 2022-08-22 04:58:42

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