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Metal-ceramic structure with intermediate high temperature reaction barrier layer

机译:具有中间高温反应阻挡层的金属陶瓷结构

摘要

A Si--SiC ceramic layer is bonded to a non-porous SiC substrate with the Si etched from the layer to form a relatively porous surface on the otherwise non-porous high strength SiC substrate. A quartz layer is softened by heating and forced into the pores of the porous layer to form a mechanical bond to the SiC substrate. A refractory metal layer is bonded to the quartz layer to complete the joint. A refractory metal support component is then bonded to the refractory layer whereby the quartz serves as a high strength, high temperature reaction barrier between the metal of the refractory layer and the silicon of the SiC substrate.
机译:将Si-SiC陶瓷层粘结​​到无孔SiC衬底上,并从该层上蚀刻出Si,从而在原本无孔的高强度SiC衬底上形成相对多孔的表面。石英层通过加热而软化并被迫进入多孔层的孔中以形成与SiC衬底的机械结合。将难熔金属层粘结到石英层以完成连接。然后将耐火金属载体组分粘结到耐火层上,由此石英充当耐火层的金属和SiC衬底的硅之间的高强度,高温反应阻挡层。

著录项

  • 公开/公告号US5200241A

    专利类型

  • 公开/公告日1993-04-06

    原文格式PDF

  • 申请/专利权人 GENERAL ELECTRIC COMPANY;

    申请/专利号US19890353580

  • 发明设计人 RICHARD L. MEHAN;HERMAN F. NIED;

    申请日1989-05-18

  • 分类号B32B17/06;B32B15/04;

  • 国家 US

  • 入库时间 2022-08-22 04:58:32

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