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Hermetically sealed aluminum package for hybrid microcircuits

机译:用于混合微电路的密封铝封装

摘要

A hybrid package in which Kovar feedthroughs are friction welded to an aluminum housing. Friction welding produces a very strong weld joint which resists the thermal stresses induced between the aluminum housing and Kovar feedthroughs by the large difference in their coefficients of thermal expansion. Friction welding also produces a very small heat affected zone, while brazing, soldering and other types of welding produce large heat affected zones which can cause annealing problems. The aluminum package is easy to machine, light in weight and provides good heat dissipation for the hybrid microcircuits in the package.
机译:一种混合包装,其中可伐合金的穿通线被摩擦焊接到铝制外壳上。摩擦焊接产生非常牢固的焊接接头,该接头可抵抗铝外壳和科瓦合金引线之间的热应力,这是由于它们的热膨胀系数存在很大差异。摩擦焊接也产生很小的热影响区,而钎焊,软焊和其他类型的焊接产生很大的热影响区,这会引起退火问题。铝封装易于加工,重量轻,并且为封装中的混合微电路提供了良好的散热性。

著录项

  • 公开/公告号US5223672A

    专利类型

  • 公开/公告日1993-06-29

    原文格式PDF

  • 申请/专利权人 TRW INC.;

    申请/专利号US19900535628

  • 发明设计人 MARIJAN D. GRGAS;GEORGE G. PINNEO;

    申请日1990-06-11

  • 分类号H01L23/02;H01B17/26;

  • 国家 US

  • 入库时间 2022-08-22 04:58:09

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