首页> 外国专利> EXCIMER LASER BEAM MACHINING METHOD, EXCIMER LASER BEAM MACHINE TO EXECUTE THE METHOD, AND RESIN FILM FORMED BY THE MACHINE

EXCIMER LASER BEAM MACHINING METHOD, EXCIMER LASER BEAM MACHINE TO EXECUTE THE METHOD, AND RESIN FILM FORMED BY THE MACHINE

机译:准分子激光束加工方法,准分子激光束机器执行方法以及由该机器制成的树脂膜

摘要

PURPOSE:To prevent the material to be machined from being damaged, and to execute the machining with high precision by absorbing or scattering the excimer laser beam transmitted through the holding member. CONSTITUTION:The reflection of a holding member 21 of the excimer laser beam passing through a film 12 at the holding surface 21a is prevented by a reflection preventing film, and the energy density of the excimer laser beam is reduced by diffusing the transmitting excimer laser beam between the holding surface 21a and the rear surface 21b to be attenuated to the energy level below the threshold. The surface 22a of a supporting body 22 absorbs or scatters the excimer laser beam, and the energy of the excimer laser beam reflected in the direction of the film 12 is further attenuated. This constitution prevents the rear surface 12c of the film 12 from being damaged by the excimer laser beam reaching the rear surface side 12c of the film 12, and improves the machining precision of the film 12.
机译:目的:为防止待加工的材料受到损坏,并通过吸收或散射透过保持部件的受激准分子激光束,以高精度进行加工。组成:准分子激光束的保持元件21在保持表面21a处穿过膜12的反射被防反射膜阻止,并且准分子激光束的能量密度通过扩散透射的准分子激光束而降低保持表面21a和后表面21b之间的能量衰减到低于阈值的能级。支撑体22的表面22a吸收或散射受激准分子激光束,并且在膜12的方向上反射的受激准分子激光束的能量进一步衰减。这种构造防止了到达受光膜12的背面侧12c的准分子激光束破坏受光膜12的背面12c,并且提高了受光膜12的加工精度。

著录项

  • 公开/公告号JPH06285666A

    专利类型

  • 公开/公告日1994-10-11

    原文格式PDF

  • 申请/专利权人 RICOH CO LTD;

    申请/专利号JP19930080402

  • 发明设计人 OGAKI TAKASHI;TEZUKA SHINJI;

    申请日1993-04-07

  • 分类号B23K26/10;B23K26/00;B23K26/08;C08J7/00;

  • 国家 JP

  • 入库时间 2022-08-22 04:55:07

获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号