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CUTTING TOOL BRAZED WITH VAPOUR PHASE SYNTHETIC DIAMOND THICK FILM

机译:汽相合成金刚石厚膜钎焊切割工具

摘要

PURPOSE: To prevent occurrence of break for a long period by brazing vapour phase synthetic diamond thick film of a lamination layer consisting of boron containing layer and noncontaining layer to a cutting tool base. ;CONSTITUTION: A Mo base plate whose surface is subjected to marring process is prepared, this Mo base plate is placed on a base plate holder in the chamber of a direct current arc plasma apparatus, the Mo base plate is held therein and also the first nondope diamond layer of about 70μm thickness is formed by supplying nondope gas for 2.2 hours. Next, boron dope gas in which B2H6 gas is added to plasma gas is supplied for three hours and a boron dope diamond layer of about 70μm thickness is formed. The second nondope diamond layer of about 70μm thickness is formed by switching the plasma gas again to the nondope gas, and supplying it for two hours, and lamination diamond thick film of about 210μm total thickness is formed on the Mo base plate. The desired cutting tool is obtained by peeling this lamination diamond thick film from the Mo base plate and next brazing it to a cutting tool base.;COPYRIGHT: (C)1994,JPO
机译:目的:为防止长时间断裂,将由含硼层和非含硼层组成的层压层的气相合成金刚石厚膜钎焊到切削刀具底座上。 ;组成:准备一个表面经过打磨处理的Mo基板,将该Mo基板放置在直流电弧等离子体设备腔室内的基板支架上,将Mo基板固定在其中,并且将第一个通过供给2.2小时的非掺杂气体形成约70μm厚的非掺杂金刚石层。接下来,向其中添加向等离子体气体中添加了B 2 H 6 气体的硼掺杂气体3小时,并形成厚度约70μm的硼掺杂金刚石层。通过再次将等离子气体切换为非掺杂气体并提供两个小时来形成厚度约为70μm的第二非掺杂金刚石层,并在Mo基板上形成总厚度约为210μm的层压金刚石厚膜。通过将这种层压金刚石厚膜从Mo基板上剥离,然后将其钎焊到切削工具底座上,即可获得所需的切削工具。;版权所有:(C)1994,JPO

著录项

  • 公开/公告号JPH06285704A

    专利类型

  • 公开/公告日1994-10-11

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORP;

    申请/专利号JP19930103476

  • 申请日1993-04-06

  • 分类号B23B27/14;B23P15/28;C04B41/87;C04B41/89;C23C16/26;C23C16/38;

  • 国家 JP

  • 入库时间 2022-08-22 04:55:06

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