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Grinding and polishing equipment and grinding polishing method

机译:磨抛设备及磨抛方法

摘要

PURPOSE:To enlarge the application range by performing widely from grind generating to the grind polishing by profiling using a pan like tool by the same device. CONSTITUTION:Grinding of a cup like grindstone 29 for grinding and generating the spherical face or plane of a work 26 and of a pan like tool having uneven spherical face or plane corresponding to the spherical face or plane of a work 26, the selection of a polishing grindstone, the selection of the rotation driving of the work shaft 25 holding a tool shaft 28 equipped with a grindstone and the work 26, and grinding and polishing by the pan like tool from grinding generating are executed by the same device by the setting of a numerical control program. In this case, by following up the work shaft 25 or the tool shaft 28 moved vertically according to the angle rocking operation of the tool at the polishing and grinding times, the holding tools thereof are moved in the axial direction. Consequently the relative sliding between the work shaft 25 or tool shaft 28 and the holding tools thereof is eliminated and the pressurizing force on the work 26 becomes constant at all times.
机译:目的:通过在同一装置上使用盘状工具进行宽泛的加工,从磨削生成到通过轮廓进行磨削抛光,来扩大应用范围。组成:打磨杯状砂轮29,以打磨和产生工件26的球面或平面,以及盘状工具,其不平坦的球面或平面对应于工件26的球面或平面,选择研磨装置的设置通过以下方式在同一装置中进行:选择研磨砂轮,选择保持有磨石的工具轴28的工件轴25和工件26的旋转驱动以及通过盘状工具进行的磨削和研磨。数控程序。在这种情况下,通过跟随在抛光和研磨时间根据工具的角度摇摆操作垂直移动的工作轴25或工具轴28,其保持工具在轴向方向上移动。因此,消除了工作轴25或工具轴28与其保持工具之间的相对滑动,并且在工件26上的压力始终保持恒定。

著录项

  • 公开/公告号JPH0659613B2

    专利类型

  • 公开/公告日1994-08-10

    原文格式PDF

  • 申请/专利权人 オリンパス光学工業株式会社;

    申请/专利号JP19880265080

  • 发明设计人 渡辺 正樹;

    申请日1988-10-20

  • 分类号B24B13/02;

  • 国家 JP

  • 入库时间 2022-08-22 04:54:28

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