首页> 外国专利> MOLD FOR MOLDING, MOLDING METHOD, POLISHING DEVICE FOR STAMPER, POLISHING METHOD FOR STAMPER, STAMPER AND OPTICAL INFORMATION RECORDING MEDIUM

MOLD FOR MOLDING, MOLDING METHOD, POLISHING DEVICE FOR STAMPER, POLISHING METHOD FOR STAMPER, STAMPER AND OPTICAL INFORMATION RECORDING MEDIUM

机译:用于成型的模具,一种成型方法,用于压模的抛光装置,用于压模的抛光方法,压模和光学信息记录介质

摘要

PURPOSE: To improve the flow of a resin and to prevent the generation of strains and dislocation by changing the space in the mold for molding according to radii. ;CONSTITUTION: While the conventional stampers are plane, this stamper 1 has the thickness changing according to the radii. For example, the signal surface of the stamper 1 is stuck to a plate 8 meeting the shape of the stamper 1 desired to be obtd. by a polishing stage for the rear surface of the stamper 1 and is polished, by which the thickness in the diametral direction of the stamper 1 is freely controlled. Namely, the thickness is increased in the outer peripheral part of the range A in the radial direction of the stamper 1 in order to balance the flow of the resin and the thickness is made flat in order to improve the signals in the range B. The thickness is increased in order to decrease the strains of the resin in the range C. The thickness in this range is conversely decreased by the packing quantity of the resin, etc., in some cases. The flow of the resin is thereby improved and the generation of sink marks, strains and dislocation is prevented.;COPYRIGHT: (C)1994,JPO&Japio
机译:目的:通过根据半径改变模制模具中的空间,以改善树脂的流动性并防止产生应变和错位。 ;组成:虽然传统压模是平面的,但该压模1的厚度根据半径而变化。例如,压模1的信号表面被粘贴到与期望被压模的压模1的形状相符的板8上。通过对压模1的后表面的抛光台进行抛光,并进行抛光,从而可以自由地控制压模1的径向上的厚度。即,在压模1的径向上在范围A的外周部分中增加厚度以平衡树脂的流动,并且使厚度平坦以改善在范围B中的信号。为了减小在范围C内的树脂的应变,增加厚度。相反,在该范围内的厚度有时因树脂的填充量等而减小。从而改善了树脂的流动性并防止了缩痕,应变和位错的产生。;版权所有:(C)1994,日本特许厅&日本apio

著录项

  • 公开/公告号JPH06168483A

    专利类型

  • 公开/公告日1994-06-14

    原文格式PDF

  • 申请/专利权人 CANON INC;

    申请/专利号JP19920320499

  • 发明设计人 TANAKA TOSHIMITSU;

    申请日1992-11-30

  • 分类号G11B7/26;B29C33/30;B29C33/38;B29C45/37;

  • 国家 JP

  • 入库时间 2022-08-22 04:51:40

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