BURN-IN AT WAFER LEVEL FOR DIE WITHOUT MOUNTING

摘要

PURPOSE: To improve efficiency of handling and to reduce the necessary size of a testing facility. ;CONSTITUTION: A reusable burn-in/testing facility for testing not unified dices on a semiconductor wafer 30 comprises a pair of halved bodies 11 and 12. A first half body 11 of the testing facility is a die hollow plate, that accepts the wafer 30, and a second half body 12 establishes electrically conducted states 31 and 23 between the wafer 30 and an electric testing equipment. The opening of the testing facility is not necessary before the completion of the burn in test and an electrical test. Mutual connection is established between the unified dices or the different dices, after a burn-in tension test and an electrical test, and these as unit components or the row of components can be mounted on the inside of separate components, the row or the cluster.;COPYRIGHT: (C)1994,JPO