SURFACE ACCURACY MEASURING METHOD FOR SUBSTRATE SURFACE AND ORIGINAL PLATE FOR SURFACE ACCURACY MEASUREMENT

摘要

PURPOSE: To simply measure the flatness of the surface of an exposure substrate such as a wafer in a state where the substrate is set inside an image-formation optical device such as a projection exposure device. ;CONSTITUTION: Two sets of lines and space patterns are adjacently formed on a mask original plate, and the first period pattern 21 is provided with phase shifters 11, 12, 13 to give three kinds of phase differences of 0°, 120°, 240° in order to illuminating light, and the slippage caused by the slippage of a focal point of a pattern position on each projected image is measured between the first period pattern 21 and the second period pattern 22 having no phase shifter for measuring the flatness of the surface of a substrate such as a wafer.;COPYRIGHT: (C)1994,JPO&Japio