CHEMICAL MECHANICAL POLISHING EQUIPMENT FOR SEMICONDUCTOR WAFER, METHOD OF MOUNTING SEMICONDUCTOR WAFER POLISHING PAD ON PLATEN OF EQUIPMENT, AND POLISHING COMPOSITE PAD OF EQUIPMENT

摘要

PURPOSE: To provide an improved chemical mechanical polishing method, where trouble that two pads are suddenly separated off from each other is lessened in frequency of occurrence and slurry used for polishing is reduced in consumption in a polishing equipment. ;CONSTITUTION: A polishing equipment is equipped with a rotary platen 206 possessed of a surface, at least a polishing pad 208 (upper pad) possessed of a front surface which polishes a semiconductor wafer 220 and a rear surface which is bonded to the surface of the platen 206, and a bead 230 of gasket material which extends around the peripheral region of the polishing pad 208.;COPYRIGHT: (C)1994,JPO