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Miniaturized high frequency circuits

机译:小型化高频电路

摘要

The interconnection structure to reduce crosstalk in reentrant off-chip RF selectivity uses differential circuits (402,415), transmission lines (423,424) and off-chip filters (422) in a structure that balances the parasitic capacitances associated with all of the differential elements. The structure includes a substrate (409) with a differential generating circuit and a receiving circuit (415). Two differential transmission lines, each with constant characteristic impedance, and each with balanced capacitance to ground, are closely spaced for some distance and couple the circuits to closely spaced terminating pads (403). A ground plane (412) is shared under both transmission lines. A second substrate (408) has a reentrant RF path (406) with the first substrate and contains an RF function such as a filter or a delay line.
机译:减少可重入的片外RF选择性中的串扰的互连结构在平衡与所有差分元件相关的寄生电容的结构中使用了差分电路(402,415),传输线(423,424)和片外滤波器(422)。该结构包括具有差分产生电路和接收电路(415)的基板(409)。两条差分传输线,每条都具有恒定的特征阻抗,并且每条都具有对地的平衡电容,它们紧密间隔一定距离,并将电路耦合到紧密间隔的终端焊盘(403)。两条传输线共用一个接地层(412)。第二基板(408)具有与第一基板的凹入RF路径(406),并且包含诸如滤波器或延迟线的RF功能。

著录项

  • 公开/公告号IL110218D0

    专利类型

  • 公开/公告日1994-10-21

    原文格式PDF

  • 申请/专利权人 MOTOROLA INC.;

    申请/专利号IL19940110218

  • 发明设计人

    申请日1994-07-05

  • 分类号5H01LA;

  • 国家 IL

  • 入库时间 2022-08-22 04:45:35

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