Method for Separating electrolytic Burr or runoff in plastic Mold from Metallic surfaces of Semiconductors and electronic components and the similar composition in SolutionThat method is used.

摘要

1.Method for Separating electrolytic Burr trimming or plastic Mold from the metal surfaces of Semiconductor devices and electronic components similar to dip these coMponentes in a Water Solution of one or more Organic Solvents.Conductive Salts and a Wetting Agent and Connecting components which are cleaned at the negative Pole of the direct current source of the positive Pole is connected to a counter electrode andN the same Solution, wherein during the passage of a current through a Solution, the PH value of the liquid film is directly adjacent to the metal surface CathodicRises to a value in which the Solvent in the solution causes a Softening Action in Cutting of plastic, which is sufficient to allow gas HydrogenGenerated simultaneously at the cathode, deburr or trimming of plastic mold of the metal surface.