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PROCESS FOR MAKING HYBRID MICROCIRCUITS PROVIDING ACCURATE THICK FILM RESISTOR PRINTING

机译:制作混合微电路的过程,以进行精确的厚膜电阻器印刷

摘要

A PROCESS FOR MAKING HYBRID MICBOCIRCUITSPROVIDING ACCURATE THICK FILM RESISTOR PRINTINGABSTRACTAn improved process for fabricating thick filmhybrid microcircuits that produces thick film resistorshaving electrical characteristics consistent with themicrocircuit design tolerances, in areas proximate adielectric build-up. The process includes, establishingby printing and firing a plurality of first conductortraces including the cross-under conductors to a sub-strate. Next, the resistive elements are printed andfired on the substrate and a dielectric glaze printedand fired over the resistive elements. At least onedielectric layer is then printed and fired over thecross-under conductors. A plurality of second conductortraces are next printed and fired on the substrate,including the cross-over conductors which are printedover the dielectric layer. Finally, a dielectric glazeis printed and fired over the cross-over conductors.12
机译:制作混合微电路的过程提供精确的厚膜电阻印刷抽象一种改进的厚膜制造工艺产生厚膜电阻器的混合微电路具有与微电路设计公差,在接近介质堆积。该过程包括通过印刷和烧制多个第一导体包括交叉交叉导体在内的走线策略。接下来,印刷电阻元件并在基材上烧制并印刷介电釉并击穿电阻元件。最后一个然后印刷介电层并在交叉下导体。多个第二导体接下来,将痕迹打印并打在基材上,包括印刷的交叉导体在介电层上。最后是介电釉在交叉导体上印刷并发射。12

著录项

  • 公开/公告号CA2015772C

    专利类型

  • 公开/公告日1994-09-13

    原文格式PDF

  • 申请/专利权人 AG COMMUNICATION SYSTEMS CORPORATION;

    申请/专利号CA19902015772

  • 发明设计人 KEATON WILLIAM R.;

    申请日1990-04-30

  • 分类号H05K3/12;

  • 国家 CA

  • 入库时间 2022-08-22 04:42:38

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