HEAT SEALABLE BLEND OF VERY LOW DENSITY POLYETHYLENE OR PLASTOMER WITH POLYPROPYLENE BASED POLYMERS AND HEAT SEALABLE FILM AND ARTICLES MADE THEREOF

摘要

The invention relates to heat sealable compositions used in the manufacture of films and film structures and which comprise: (a) 30 to 70% by weight of a melting temperature based polymer containing a copolymer of ethylene having a density between 0.88 g / cm3 and 0.915 g / cm3, a melt index between 1.5 dg / min to 7.5 dg / min, a molecular weight distribution of not more than 3.5 and a distribution factor of the composition greater than 70%; and (b) 70 to 30% by weight of a propylene-based polymer different from (a) containing a molar percentage of propylene between 88 and 100 mole percent of an alpha-olefin other than propylene between 12 and 0.