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Process for forming a silicon containing coating on a metallic substrate, anti-corrosion treatment process

机译:在金属基材上形成含硅涂层的方法,防腐处理方法

摘要

Process for forming a deposit containing silicon at the surface of a metal substrate, according to which the following stages are carried out, concurrently or successively: (1) subjecting the said surface to an electrical discharge with a dielectric barrier, (2) exposure of the said surface to an atmosphere containing a silicon compound in the gaseous state, the stages (1) and (2) being performed at a pressure higher than 10,000 Pa. The invention also relates to a process for the anticorrosion treatment of a metal substrate, as well as to a metallised polymeric support.
机译:在金属衬底的表面上形成含硅沉积物的方法,根据该方法,同时或相继进行以下步骤:(1)使所述表面经受介电阻挡层放电,(2)所述表面在含有气态硅化合物的气氛中进行,步骤(1)和(2)在高于10,000Pa的压力下进行。本发明还涉及金属基材的防腐处理方法,以及金属化的聚合物载体。

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