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in water redispergierbare, water-soluble polymer and at least one organic siliciumverbindung containing powder, process for their manufacture and use of such powder.

机译:在水再分散中,水溶性聚合物和至少一种含有机硅的粉末,其制备方法和使用这种粉末的方法。

摘要

Aqueous redispersible powders which contain a water-soluble polymer and at least one organic silicon compound, in which at least 50 percent by weight of the organic silicon compound(s) used to prepare these powders are liquid or solid at room temperature at 1,020 hPa (abs.), have a boiling point of at least 150 DEG C. at 1,020 hPa (abs.), and contain an average of not more than 1.8 SiC-bonded organic radicals per silicon atom, and have at least one hydrogen atom bonded directly to silicon per molecule, or at least one hydroxy group bonded to silicon per molecule, or at least one hydrocarbon radical bonded to silicon via oxygen per molecule which may be substituted by an alkoxy group, or a mixture of at least two such condensable substituents in which the organic silicon compound(s) are used in an amount of at least 30 percent by weight, based on the total weight of the powder (calculated as anhydrous powder). These powders are obtained by spray-drying aqueous mixtures of the water-soluble polymers and the organic silicon compound and may be used, for example, as hydraulic binders, as clay and coloring materials, for rendering bulk materials hydrophobic when diluted with water, and as binders for finely-divided inorganic or organic materials.
机译:包含水溶性聚合物和至少一种有机硅化合物的水可再分散粉末,其中至少50%重量的用于制备这些粉末的有机硅化合物在室温下为1,020 hPa为液体或固体( abs。),在1,020 hPa(abs。)时的沸点至少为150℃,每个硅原子平均含有不超过1.8个SiC键合的有机基团,并且至少有一个氢原子直接键合每个分子中至少一个键合至硅,或每个分子中至少一个键合至硅的羟基,或每个分子中至少一个经由氧键合至硅的烃基,其可被烷氧基取代,或至少两个这样的可缩合取代基的混合物相对于粉末(以无水粉末计)的总重量计,有机硅化合物的用量至少为30%(重量)。这些粉末是通过将水溶性聚合物和有机硅化合物的水性混合物喷雾干燥而获得的,并且可以用作例如水硬性粘合剂,粘土和着色材料,以便在用水稀释时使大块材料具有疏水性,以及作为细分的无机或有机材料的粘合剂。

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