首页> 外国专利> Prodn. of integrated semiconductor circuits - comprising partially implanting electrically non-active element in peaks of di-electrically insulated islands, before thermal oxidn.

Prodn. of integrated semiconductor circuits - comprising partially implanting electrically non-active element in peaks of di-electrically insulated islands, before thermal oxidn.

机译:产品半导体集成电路的制造方法,包括在热氧化之前将部分非电性有源元件注入电绝缘岛的峰中。

摘要

Prodn. of integrated semiconductor circuits in dielectric technology, esp. for dielectric and smart power elements, is claimed, in which an electrically non-active element, pref. N2, is partially implanted in the peaks of the dielectrically insulated islands (1,4), before starting the thermal oxidn. of the thick oxide. The lacquer mask (10,11) is appprox. 3-5 microns smaller than the dia. of the islands (1,4). The mask, used in the LOCOS process, is used for N2 implantation. Implantation dose is 1 x 10 power14-5 x 10 power16 cm power(-2). USE/ADVANTAGE - Used to produce microelectric constructional elements.
机译:产品介电技术中集成半导体电路的制造,特别是本发明要求保护用于电介质和智能功率元件的电非有源元件。在开始热氧化之前,将N2部分注入到电绝缘岛(1,4)的峰中。厚的氧化物。漆膜(10,11)是appprox。比直径小3-5微米。岛(1,4)。 LOCOS工艺中使用的掩模用于N2注入。植入剂量为1 x 10 power14-5 x 10 power16 cm power(-2)。用途/优点-用于生产微电结构元件。

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