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Circuit board layout for high data rate coupling field - has parallel connections for two SMDs on opposite sides of circuit board provided by vias

机译:用于高数据速率耦合场的电路板布局-在过孔提供的电路板相对侧具有两个SMD的并联连接

摘要

The circuit board layout-using a number of surface mounted devices and through contacts between the circuit board paths on opposite sides of the circuit board- has a number of connections for two such SMDs connected in parallel with further connections for each of these SMDs and others connected in series. Up to six SMDs (KE1....KE6) are arranged with their parallel connections symmetrical to a mirror axis (SPA) along the upper and lower surfaces of the circuit board so that the parallel connections of two devices lie directly above one another for connection via the trough contacts, with further devices directly adjacent one another to allow the series connections. ADVANTAGE - Reduced space and power required by having no lead drives and low resistance input terminals for leads increasing reliability of complete circuit.
机译:电路板布局-使用许多表面安装的设备并通过电路板相对侧上的电路板路径之间的接触-具有两个这样的SMD并联连接的多个连接以及这些SMD和其他每个SMD的进一步连接串联连接。最多布置六个SMD(KE1 ... KE6),它们的并联连接沿电路板的上,下表面对称于镜像轴(SPA),因此两个设备的并联连接彼此直接位于上方。通过槽形触点进行连接,其他设备彼此直接相邻以实现串联连接。优势-由于没有引线驱动器和低电阻输入端子(用于引线),因此减小了空间和功率,从而提高了整个电路的可靠性。

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