首页> 外国专利> Device for automatic cutting of adhesive tape - wound on lap material has cutting head that moves against lap good and carries adhesive tape guide rolls on joint holder

Device for automatic cutting of adhesive tape - wound on lap material has cutting head that moves against lap good and carries adhesive tape guide rolls on joint holder

机译:用于自动切割胶带的装置-缠绕在棉卷材料上的切割头可与棉卷物品相对移动,并在接头支架上承载胶带导辊

摘要

The device features a severing head (2) that moves against the lap material (8) and carries two parallel adhesive tape guide components (13a,13b) mounted on a joint holder (16). The holder rotates around an axis which is parallel to the guide component axes. A cutting unit (15) moves into the space between the guide components (13a,13b) to effect the cutting of the adhesive tape (12) located in between. USE/ADVANTAGE - For use in packing bundles located on a pallet with self-adhesive tape in order to secure the goods on the pallet. The invention can be used in existing winding systems and provides for a fully automatic, high-quality application of an adhesive tape.
机译:该装置具有一个切断头(2),该切断头紧靠搭接材料(8)移动,并带有两个平行的胶带导引组件(13a,13b),该组件安装在接头支架(16)上。支架绕平行于导向部件轴线的轴线旋转。切割单元(15)移入引导部件(13a,13b)之间的空间,以切割位于其间的胶带(12)。使用/优点-用于在带有自粘胶带的货盘上的捆扎捆扎中将货物固定在货盘上。本发明可用于现有的缠绕系统中,并提供胶带的全自动,高质量的应用。

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