Ensuring optimum conditions prior to laser joining - whereby IR emission from the parts is monitored and compared with predetermined value prior to joining process

摘要

Appts. for joining together two parts consists of a laser beam (11) which is directed onto the two parts via a spectral-selective reflection/permeable mirror (5) and condensor lense (7) for focussing the laser, a support for holding the two parts which is moveable in an X-Y plane to ensure the laser focal point is located on the joint area, a temperature sensor (13) which receives the infrared radiation emitted from the parts which pass through the mirror (5), and a computer (21) which receives a signal from the sensor (13) representing the temperature of the part and compare it with a predetermined signal corresponding to a previously obtained satisfactory joint. Once the signals correspond after various adjustments the joint can be produced. USE/ADVANTAGE - Joining connection leads to semiconductor chips. By using a laser beam in such a way, fault-free reliable joints can be produced.