Polyimide and polyamic acid compsns. modified with polyarylene ether - used in prodn. of flexible laminate with metal foil esp. for printed circuit with good solvent resistance and low thermal expansion coefft.

摘要

The claim cover : compsns. (I) contain 75-99 wt.% homo- or copolyimide (II) and 1-25 wt.% polyarylene ether (III), comprising 1-100 mole.% units of the formula -(-Ar1-O-Ar2-O-)- (IIIA) and 99-0 mole.% units of the formula -(-Ar3-O-Ar2-O-)- (IIIB); and (b) compsns. (IV) contg. 75-99 wt.% polyamic acid (V) and 1-25 wt.% (III). (II) comprises 75-100 mole.% units of formula (IIA) and 0-25 mole.% units of formula (IIB); and (V) comprises 75-100 mole.% units of formula (VA) and 0-25 mile.% units of formula (VB). In the formulae, R is 1-6C alkyl, 1-6C alkoxy, 6-14C aryl or halogen; n is 0-4; R1 is e.g. 2-12C alkylene, -Phe-, -PHe-CH2-, -CH2-Phe-CH2-, -Naph-, -Phe-X-Phe- etc.; X is e.g. a direct bond, -CH2- -CHMe-, -S-, -O-, -SO2-, -CO-, -NHCO- etc.; R2 is e.g. phen-1,2,4,5-tetrayl, naphth-1,4,5,8-tetrayl, diphenyl-2,2',3,3'-tetrayl, =Phe'-X-Phe'=, =Phe'-X-Phe=X-Phe'= etc.; Ar1 is e.g. -Phe-, -PHe-Phe-, phenyl-substd.-Phe-, -Naph-, -Phe-Z-Phe-, -Phe-Z-Phe-Z-Phe- etc. ; Z is e.g. -CH2-, -CMe2-, -C(Me)(Ph)-, -C(CF3)2-, -S-, -O-, -SO-, -SO2- etc.; Q is a direct bond, -CH2-, -O- or -CO-; Ar2 is -Phe"-Y-(Phe-Y-)a-Phe"-, -Phe"-Y-(Phe-)b-Y--Phe"-, cyanophenylene, pyridindiyl or pyridazindiyl; Y is -SO-, -SO2- or -CO-; a is 0 or 1; b is 2 or 3; Ar3 = as Ar1 or p-quinon-2,5-diyl. -Phe- is phenylene; -Naph- = naphthylene; -Cyc- is cyclohexylene; -Cyc'- is 1,4-cyclohexylene; =Phe'- and -Phe= are phen=1,3,4-tetrayl; -Phe"- is p-phenylene; in R1-2 and Ar1-3, the aromatic and cycloaliphatic rings may have 1-6C alkyl, 1-6C alkoxy or halo substit(s). Prodn. of flexible laminates is also claimed. USE/ADVANTAGE - (I) are used in laminates of metal foil(s), pref. Cu foil, and directly applied film(s) of (I); and (IV) in the prodn. of flexible laminates with metal foils (claimed). The laminates are useful for making electrical circuits, esp. printed circuits. (I) can be used as matrix resins, lacquers, adhesives and coatings for making various industrial prods., e.g. fibre-reinforced composites, films, sheets or compression mouldings. Addn. of (II) makes (I) highly flexible, without impairing the high solvent resistance and low coefft. of thermal expansion of (II).