chipresidente zwischentreiber for discrete wsi systems.

摘要

In discrete wafer scale integration, in short WSI, pre-tested chips (C1-C16) are mounted and bonded on a pre-wired wafer (W). Silicium is mainly used for the wafer substrate, since the wafer can then be economically wired by a standard multilayering process. The conductivity of such wafer microwiring forbids the use of long feed lines with long cycle times, so that intermediate drivers (Tr1-Tr4) must be used. Separate driver chips that must be located, bonded and tested besides the operating chips themselves have been used until now to solve this problem. In the proposed WSI system, the intermediate drivers are not separate chips but are implemented on the operating chips themselves.