think and fed for one slice.

摘要

To handle wafer-type bodies, in particular semiconductor wafers, in a vacuum system, these have to be transported and deposited between stations. A wafer (17) is supported at its edge by two support arms (21) each having two fingers (22) and resting surfaces (23) at the finger ends in four edge regions of the wafer (17) distributed around the circumference. In order to grip or release the wafer by reducing or increasing the mutual spacing of the support arms (21), both support arms are each attached to a piston/cylinder unit (24). In the latter, the cylinder (27) moves in each case relatively to the stationary piston rod (25), both piston rod ends being attached opposite one another to a rotating spindle (26) which extends perpendicularly to the cylinder axes and by means of which the two piston/cylinder units (24) with the support arms (21) can be swivelled from one station to the next inside the vacuum system. The two piston/cylinder units (24) are actuated by means of a pressurised medium for moving the support arms (21) apart which is supplied via lines (31) through the hollow rotating spindle (26) and through the hollow piston rods (25). The actuation takes place against the action of a compression spring (34) for the opposite excursion which rests on the cylinder (27) and on the piston (29) inside the cylinder (27). …IMAGE…