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Multilayer wall in wooden frame - construction, this construction of the wood frame component, as well as in which respect in this house, in particular a low-energy house

机译:木结构多层墙-结构,木结构部件的这种结构,以及该房屋(尤其是低能耗房屋)的各个方面

摘要

The wall structure comprises innermost light panels (50) for the dry fitting, coupled wood chip panels (40), casing (34) of wooden planks (36). The structure further consists of organic/biological insulating material (22), another casing of wooden planks, second layer of wood chip panels, and an outer plaster layer (52). Pref. the wall thickness ratio of the layers is approx. 1:5:2:13:2:5:1. The first inner layer panels are of plaster cardboard type typically consisting of natural burnt gypsum and cellulose fibres, pref. 15 mm thick. The woodchip panels may be of magnesite bonded wood wool.
机译:墙壁结构包括用于干式安装的最里面的轻面板(50),连接的木屑面板(40),木板(36)的外壳(34)。该结构进一步由有机/生物绝缘材料(22),另一木板外壳,第二层木屑板和外灰泥层(52)组成。首选各层的壁厚比约为1。 1:5:2:13:2:5:1第一内层板是石膏纸板类型的,通常由天然烧石膏和纤维素纤维制成。 15毫米厚。木片面板可以是菱镁矿粘结的木丝。

著录项

  • 公开/公告号DE9410265U1

    专利类型

  • 公开/公告日1994-08-18

    原文格式PDF

  • 申请/专利权人 RENKL RUDOLF 94541 GRATTERSDORF DE;

    申请/专利号DE19940010265U

  • 发明设计人

    申请日1994-06-24

  • 分类号E04B2/70;E04B1/74;E04H1/02;

  • 国家 DE

  • 入库时间 2022-08-22 04:34:10

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