首页>
外国专利>
LIMITING TIN SLUDGE FORMATION IN TIN OR TIN/LEAD ELECTROPLATING SOLUTIONS
LIMITING TIN SLUDGE FORMATION IN TIN OR TIN/LEAD ELECTROPLATING SOLUTIONS
展开▼
机译:限制锡或锡/铅电镀解决方案中的锡浆形成
展开▼
页面导航
摘要
著录项
相似文献
摘要
Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.
展开▼