Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering

摘要

A sintering process is described using a glass-ceramic slurry containing an alloy powder or flakes selected from a group of alloys consisting of:PP______________________________________ PPFe--Cr Cu--Ti PPFe--Cr--Ni Ag--Ti PPCr--Al Nb--Al PPNi--Cr Cu--Al P PNi--Al Cu--Al--Cr PPFe--Al;PP______________________________________ P PPPThe slurry is molded and later is sintered in a steam atmosphere at a temperature of about 1000° C. to yield a glass-ceramic substrate toughened against crack propagation and useful in the packaging of semi-conductor device chips.