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Flexibilizers of hydroxyphenyl silicone oil-epoxy resin product and epoxy silicone oil-phenol resin product
Flexibilizers of hydroxyphenyl silicone oil-epoxy resin product and epoxy silicone oil-phenol resin product
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机译:羟苯基硅油-环氧树脂产品和环氧硅油-酚树脂产品的增韧剂
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摘要
An epoxy resin composition for encapsulating a semiconductor device includes a flexibilizer constituted by a pre-reaction product of an epoxy resin and a modified silicone oil having hydroxyphenyl groups, as well as a flexibilizer constituted by a pre-reaction product of a phenol resin and a modified silicone oil having epoxy groups. Furthermore, an epoxy resin is used as a chief material, and a curing agent is added. The epoxy resin composition is heat resistant and moisture resistant, and has a low modulus of elasticity, a low coefficient of expansion, and a high glass transition temperature equivalent to or higher than that of a conventional epoxy resin composition.
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