Barbituric acid-modified bismaleimide with diamine and polyisocyanate- modified epoxy resin

摘要

A process for manufacturing a high glass transition temperature printed circuit board comprising blending a modified bismaleimide resin into a modified epoxy resin is disclosed. Particularly the material is manufactured by blending a bismaleimide resin reacted with barbituric acid and its derivative thereof and an epoxy resin with an oxazolidone ring resulting from the reaction of a polyisocyanate and an epoxy resin modified with a secondary diamine and followed by curing. The resultant product has a high glass transition temperature, a good adhesion, flame retardancy, and a low bromine content.