PURPOSE:To prepare the title compsn. highly resistant to thermal decomposition during molding by compounding a methyl methacrylate-alpha-methylstyrene copolymer resin with a hindered phenol compd. and a phosphite compd. each in a specified amt. CONSTITUTION:100 pts.wt. methyl methacrylate-alpha-methylstyrene copolymer resin is compounded with 0.01-1.0 pt.wt. hindered phenol compd. [e.g. octadecyl 3-(3,5-di-tert.-butyl-4-hydroxyphenyl)propionate] and 0-0.5 pts.wt. phosphite compd. [e.g. tris(2,4-di-tert.-butylphenyl) phosphite].
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