PURPOSE: To obtain a polyhexamethylene adipamide resin composition, capable of providing a high-strength and highly heat-resistant molding and remarkably suppressing the production of a branches structure due to the long-term retention thereof in a molten state in polymerizing or molding steps. ;CONSTITUTION: This polyhexamethylene adipamide resin composition contains (a) 0.005-1.0wt.% alkali metallic hydroxide, (b) 0.005-1.0wt.% one or more compounds selected from the group consisting of phenylphosphinic acid, phenylphosphonic acid and alkali metallic salts thereof, (c) 0.3-300ppm copper and (d) 0.005-1.0wt.% alkali metallic halide in polyhexamethylene adipamide resin.;COPYRIGHT: (C)1995,JPO
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