SOLDERING WITH SEAL RING AG BRAZING AND MANUFACTURE THEREOF

摘要

PURPOSE: To reduce warping and enhance mass productivity by temporarily brazing at least one Ag brazing filler laid out at a specified position of one main surface of a sealing main body. ;CONSTITUTION: Under the condition that an Ag brazing filler 13 is laid out at a specified position of a main body 12, the filler and a jig are placed into an electric furnace in a nitrogen gas atmosphere where they are heated and treated at a temperature of 781°C for 10 minutes, thereby finishing a sealing main body and the Ag brazing filler. The amount of warping of this sealing 11 is about 0.002mm in average, which is lower compared with the conventional warping whose amount is 0.2mm. Compared with conventional cases, a package under this construction is capable of obtaining equal or better adhesion. Furthermore, this construction makes it possible to manufacture in about 10% working hours compared with the previous working hours and minimize warping and upgrade adhesion and mass productivity, thereby manufacturing higher reliability semiconductor ceramic packages.;COPYRIGHT: (C)1994,JPO