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Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering
Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering
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机译:将电子元件焊接到印刷电路板上的方法和装置,以及通过焊接得到的电子元件和印刷电路板的组装
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摘要
In accordance with the present invention, there is provided a soldering process comprising the steps of: providing in a furnace first and second heaters each adapted to emit infrared energy; setting a printed circuit boad, which has a solder paste and an electronic component thereon, in the furnace; heating the printed circuit boad with the first heater; and heating the electronic component with the second heater;wherein the first and second heaters have different radiation spectra such that infrared energy irradiated by the first heater is more absorbed by the printed circuit board and less absorbed by the electronic component than that irradiated by the second heater. The present invention also provides a soldering apparatus for use in such soldering process.
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