CURABLE EPOXY VINYLESTER OR POLYESTER COMPOSITION HAVING A LOW PEAK EXOTHERM DURING CURE

摘要

The invention is a curable resin composition comprising A) an epoxy vinylester resin or a polyester resin; B) a polymerizable monomer; C) a chelating agent; and D) a copper salt or complex of copper with an alcohol, aldehyde or ketone; and E) an inhibitor comprising alkylated phenolic compound or polyhydroxy aromatic compound. In another aspect it is a resin system comprising I) a resin composition comprising: A) an epoxy vinylester resin or a polyester resin; B) a polymerizable monomer; C) a chelating agent comprising a polar or aromatic ring containing compound; D) a copper salt or a copper complex with an alcohol, ketone or aldehyde; and E) an inhibitor comprising alkylated phenolic compound or a polyhydroxy aromatic hydrocarbon and I) a catalyst system which comprises E) an additional amount of an inhibitor; F) optionally an aliphatic amine, an aromatic amine, or a heterocyclic amine; G) a peroxide or persulphate initiator; and H) a transition metal accelerator. In another embodiment the invention is a method of curing a curable resin composition which comprises contacting the resin composition (I) with a catalytic amount of the catalyst composition (II) optionally contacting the mixture with a reinforcing structure and allowing the composition to cure; under conditions such that the peak exotherm 100 grams of the reaction mass is from 40 C to 120 C and the cure time is from 30 to 120 minutes.