ELECTROLESS PLATING SOLUTION OF A PLASTIC MATERIAL TO SOLVED EASLIY AN ALKALI

摘要

The plating solution contains (A) copper salt (copper sulfate or copper chloride) ; (B) 64mM/L complexing agent for cupric ions such as 1,5,8,12-tetraazadodecane, 1,4,8,12-tetraazacyclopentadecane, 1,4,8,12-tetraazaundecane, or 1,4,8,11-tetraazacyclotetradecanol ; (C) 68mM/L reducing agent of borane compound such as dimethylamineborane, tributylamineborane or pyridineborane ; (D) pH buffer agent such as valine(pH7-pH8), tris(hydroxymethyl) aminomethane (pH9), or borax (pH8-pH9) ; (E) 0.2mM/L2mM/L additive such as 1,10-phenanthroline, 2,2-bipyridine or cyanide; and (F) 0.05M/l0.2M/L surfactant such as laurylsulfate, FC96 polyethyleneglycol, polyethyleneether, or hexadecyltriammoniumhydroxide.