The thermal expansion is not equal to a unit reducing the printed circuit board for a ceramic wireless chip carrier.

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• 2. 用于半导体和电子子系统封装的芯片载体衬底和印刷电路板上的硬波图案设计 [P] . 中国专利： CN101238576A . 2008-08-06
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  机译： 用于陶瓷无铅芯片载体的热膨胀式不匹配印刷线路板。

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  机译： 可有效降低热膨胀率的印制电路板的绝缘树脂成分和包括该印制电路板的绝缘电路板

• 5. THERMAL EXPANSION MISMATCH FORGIVABLE PRINTED WIRING BOARD FOR CERAMIC LEADLESS CHIP CARRIER [P] . 欧洲知识产权局专利： EP0364551B1 . 1994-05-25

  机译： 陶瓷无铅芯片载体的热膨胀式不匹配印刷线路板

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