hexafluoroisopropyliden containing polyimidoligomere and polymers.

摘要

Polyimide polymers having a relatively low dielectric constant and good solvent resistance, are formed by polymerization of a polyimide oligomer having the formula IMAGE IMAGE +TR IMAGE wherein R is selected from the group consisting of: -C 3BOND CH, -CH=CH2, -CN, and IMAGE wherein R1 is -H or -CH3, and n=1-20. Preferably R is an acetylene group. These polymers may also be formed from the corresponding polyamic acid oligomers. These polymers are useful for forming dielectric layers, particularly in multilayer semiconductor devices.