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Device for controlling the cross-sectional properties of an ion implanter.

机译:用于控制离子注入机的截面特性的装置。

摘要

A defining aperture for an ion implanter (10) in which wafers (29) are implanted at high tilt angles, which aperture is configured to project a substantially circular beam pattern on the surface of the tilted wafer. One embodiment includes one or more movable aperture plates (78, 96) having elliptical apertures (86) formed therein operating in conjunction with a fixed aperture plate (76) having a circular aperture. Other embodiments include movable elliptical apertures, and a plate (81) having a circular aperture (83) wherein the plate is rotatable about an axis (85) perpendicular to the tilt axis (70) of the wafer. Where an electron flood ring is used, one or more movable rings (82) having elliptical apertures can be used.
机译:离子注入机(10)的限定孔,晶片(29)以高倾斜角注入其中,该孔被配置为在倾斜的晶片的表面上投射出基本上圆形的束图案。一个实施例包括一个或多个具有形成在其中的椭圆形孔(86)的可移动孔板(78、96),其与具有圆形孔的固定孔板(76)一起操作。其他实施例包括可移动的椭圆孔,以及具有圆形孔(83)的板(81),其中该板可绕垂直于晶片的倾斜轴(70)的轴(85)旋转。在使用电子溢流环的情况下,可以使用一个或多个具有椭圆形孔的可移动环(82)。

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