RESIN PASTE, SOLDER PASTE, AND METHOD OF APPLYING INORGANIC POWDER PASTE

摘要

PURPOSE: To enable application of easy control and good efficiency by heating and raising the temperature of a base material to be applied in advance when applying a paste such as solder paste. CONSTITUTION: When solder paste 5 discharged and put in a tip of a needle 4, metallic terminals 2a, 2b of chip-type beads 1 which are base material are heated to raise the temperature thereof on a carrier rail 7a with a built-in temperature-up heater 7 in a part thereof. When the solder paste 5 comes into even a slight contact with the metallic terminals 2a, 2b whose temperature is raised, heat is conducted in a moment, viscosity lowers and fluidity improves. Therefore, the distance between the tip of the needle 4 and the metallic terminals 2a, 2b can be readily controlled for applying the solder paste 5 which is discharged and put in the tip of the needle 4 without remainder. Since a paste is not directly heated, there is no possibility of hardening and separation thereof.