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Automatic soldering device, its teaching device and teaching method, solder inspection device and inspection method, and soldering correction device and correction method
Automatic soldering device, its teaching device and teaching method, solder inspection device and inspection method, and soldering correction device and correction method
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机译:自动焊接装置,其教导装置和教导方法,焊料检查装置和检查方法以及焊接校正装置和校正方法
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摘要
A soldering-part kind table (26) contains beforehand the information on soldering conditions such as the position and the angle of a soldering iron, the amount of solder fed, and heating time, for each soldered part. In a floppy disc of a floppy disc apparatus (24), stored is beforehand the information on the parts to be mounted on a board corresponding to the board ID. When the board ID is inputted, the parts to be mounted on the board are displayed on a display apparatus (23). The operator causes the sort table (26) of the parts for soldering to be displayed, and specifies the information on the soldering conditions corresponding to the part group to which the displayed parts belong. Thereby, created is a teaching data table (27) containing the information on the soldering conditions of the parts. According to the table (27) the parts are automatically soldered.
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