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Semi-conductivity high polymer materials constituent

机译:半导电高分子材料成分

摘要

PURPOSE:To obtain an electrically semiconductive composition, containing good electrically conductive material powder having a specific volume resistivity and hydrophobized particles of electrically conductive zinc in an insulating high polymer molding material and capable of forming developing rolls, etc., with homogeneous volume resistivity. CONSTITUTION:An electrically semiconductive composition obtained by blending (A) good electrically conductive material powder (e.g., carbon or graphite powder) having 10-6-10-1OMEGA.cm volume resistivity and preferably =1mum particle diameter with (B) hydrophobized particles of electrically conductive zinc, prepared by adding a treating agent consisting essentially of Al to zinc oxide powder, stirring, heat-treating the resultant mixture and treating the surface of the resultant electrically conductive ZnO with a titanate based coupling agent or fatty acid based compound and having 101-104OMEGA.cm volume resistivity and preferably 0.1-3mum particle diameter at ratios (wt.%) satisfying formulas I-IV in an insulating high polymer molding material (preferably phenolic resin).
机译:目的:获得一种半导电组合物,其包含具有特定体积电阻率的良好的导电材料粉末和在绝缘的高分子成型材料中的导电锌的疏水化颗粒,并能够形成均一的体积电阻率的显影辊等。组成:一种半导体组合物,其通过将(A)具有10 -6 -10 -1Ω·cm体积电阻率且优选<=1μm粒径的良好导电材料粉末(例如碳或石墨粉末)与(B)导电锌的疏水化颗粒,其通过在氧化锌粉末中添加基本由Al组成的处理剂,搅拌,热处理所得混合物并用钛酸酯基偶联剂处理所得导电ZnO的表面而制得。在绝缘的高分子成型材料(优选酚醛树脂)中,具有10 1 -10 4Ω·cm的体积电阻率和优选0.1-3μm的粒径(以重量%计)满足式I-IV的比率的脂肪酸基化合物)。

著录项

  • 公开/公告号JPH0819254B2

    专利类型

  • 公开/公告日1996-02-28

    原文格式PDF

  • 申请/专利权人 東海ゴム工業株式会社;

    申请/专利号JP19880097568

  • 发明设计人 堀尾 幸伸;長野 悦子;

    申请日1988-04-19

  • 分类号C08K3/00;C08K9/04;C08L101/00;G03G15/08;H01B1/20;

  • 国家 JP

  • 入库时间 2022-08-22 04:01:03

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