首页> 外国专利> ELECTRONIC PARTS MOUNTING BOARD, ELECTRONIC PARTS MOUNTING JIG, AND ELECTRONIC PARTS MOUNTING METHOD

ELECTRONIC PARTS MOUNTING BOARD, ELECTRONIC PARTS MOUNTING JIG, AND ELECTRONIC PARTS MOUNTING METHOD

机译:电子零件安装板,电子零件安装夹具和电子零件安装方法

摘要

PURPOSE: To provide an electronic parts mounting board, electronic parts mounting jig, and electronic parts mounting method by which electronic parts can be easily placed on a substrate and the yield of electronic parts can be improved by eliminating the occurrence of positional displacement at the time of soldering the parts by using the reflow, etc. ;CONSTITUTION: Guide pins are erected on a mounting jig 1 at the positions corresponding to the positions of the through holes 7 and side cut through holes 6 of a mounting board 3. The board 3 is provided with the through holes 7 and 6 along the outer periphery of electronic parts 4 so as to position the parts 4 to a prescribed position by using the guide pins.;COPYRIGHT: (C)1996,JPO
机译:用途:提供一种电子零件安装板,电子零件安装夹具和电子零件安装方法,通过该方法可以容易地将电子零件放置在基板上,并且可以通过消除当时发生的位置偏移来提高电子零件的成品率组成:构成:在安装夹具1上的对应于安装板3的通孔7和侧面切孔6的位置竖立了定位销。板3沿电子部件4的外周设置有通孔7和6,以便通过使用导向销将部件4定位到预定位置。版权所有:(C)1996,JPO

著录项

  • 公开/公告号JPH08204292A

    专利类型

  • 公开/公告日1996-08-09

    原文格式PDF

  • 申请/专利权人 TOKIN CORP;

    申请/专利号JP19950031593

  • 发明设计人 NOBA TAKAYA;

    申请日1995-01-26

  • 分类号H05K1/02;H05K13/04;

  • 国家 JP

  • 入库时间 2022-08-22 03:59:09

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号