POLYIMIDE BUMP AND SEMICONDUCTOR ELEMENT MOUNTING BUMP, MANUFACTURE OF THEM AND POLYIMIDE BUMP TESTING METHOD

摘要

PURPOSE: To form a polyimide bump generating no fatigue failure at the base by grooving the head top of a polyimide bump on an electrode pad. ;CONSTITUTION: A polyimide bump 5 30μm in diameter and 30μm high is formed leaving a polyimide 4' on an Al pad 3 by developing and curing the polyimide 4', and then a groove 6 with an X head top of polyimide bump 5 is moved down. The groove 6 is 10μm deep and 3μm wide. On the polyimide bump 5 of the above-mentioned constitution, when it is connected using a substrate 8 and solder 9 after the outside surface, including the inside surface of the groove 6, has been covered by an Al and Ti/Cu conductive film 7, the air when solder is fused does not remain in the concavity 10 in head top of the bump, and the air is absorbed to the groove 6. Also, as fused solder 9 intrudes into the groove 6, the surface area of junction of soldering is increased. As a result, junction strength is increased, stabilized and reliability can be enhanced.;COPYRIGHT: (C)1996,JPO