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Multiple quantum well optical bistable semiconductor laser - The

机译:多量子阱光学双稳态半导体激光器-

摘要

PURPOSE:To mike it possible to perform high speed operation, in which relaxation vibration is suppressed, by providing an active layer in a multiple quantum well structure, the surfaces of laser resonators and a plurality of electrodes, which are divided with groove, in the axial direction connecting the surfaces of the resonators. CONSTITUTION:A P-type AlGaAs clad layer 22 is grown on a P-type GaAs substrate 21 by an MBE growing method. Then non-doped GaAs and AlGaAs are alternately laminated, and an active layer 23 is formed. Thereafter, both sides of the central part are chemically etched to the clad layer 22. Thus a mesa structure 25, which is extended in the direction along the axis of a resonator, is formed. Then, a P-type AlGaAs current blocking layer 26, an N-type AlGaAS embedded layer 27 and an N-type GaAs cap layer 28 are sequentially laminated, and the mesa structure 25 is embedded. Then parts of the cap layer 28 and the clad layer 24 are etched, and a groove 29 is formed. Thereafter, Zn is diffused into the active layer 23 directly beneath the groove 29. The well layer 23 becomes a mixed crystal state by said diffusion and the layer is transformed into saturable absorbing region 33. Then an SiO2 film 30 is closely attached to a part other than the groove 29. An electrode 31 and an electrode 32 are formed directly on the mesa structure 25, thereby the laser is completed.
机译:目的:通过在多量子阱结构中设置有源层,在激光谐振器的表面和由凹槽分隔的多个电极,可以实现抑制松弛振动的高速操作。连接谐振器表面的轴向。组成:通过MBE生长法在P型GaAs衬底21上生长P型AlGaAs覆盖层22。然后,将非掺杂的GaAs和AlGaAs交替层叠,并形成有源层23。此后,中心部分的两侧被化学蚀刻到覆层22。因此,形成沿沿着谐振器的轴线的方向延伸的台面结构25。然后,依次层叠P型AlGaAs电流阻挡层26,N型AlGaAS嵌入层27和N型GaAs覆盖层28,并且嵌入台面结构25。然后,蚀刻覆盖层28和覆盖层24的一部分,并形成凹槽29。此后,Zn直接在凹槽29下方扩散到有源层23中。阱层23通过所述扩散而变成混合晶态,并且该层转变成饱和吸收区33。然后,SiO 2膜30紧密地附着到一部分上。除了凹槽29之外,电极31和电极32直接形成在台面结构25上,从而完成激光。

著录项

  • 公开/公告号JP2518255B2

    专利类型

  • 公开/公告日1996-07-24

    原文格式PDF

  • 申请/专利权人 NIPPON ELECTRIC CO;

    申请/专利号JP19870044198

  • 发明设计人 ODAGIRI JUICHI;

    申请日1987-02-27

  • 分类号H01S3/18;

  • 国家 JP

  • 入库时间 2022-08-22 03:57:58

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