Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system

摘要

A device and method for cooling an integrated circuit package-in particular, a microprocessor-within an enclosed computer system. The device comprises a blower, a first heat sink attached to the microprocessor, and a first air duct coupling the blower to the first heat sink. The blower has an air intake from the exterior of the computer system. The blower generates an air stream which flows through the first air duct to the first heat sink for cooling the first microprocessor. A second air duct connected to the first heat sink may be used to subsequently direct the air stream to a second heat sink for cooling a second microprocessor. An efficient ducted heat sink for use in this cooling system can be easily constructed by attaching two extruded heat sinks.