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Automated fitting and soldering of components on three=dimensional SMT circuit boards

机译:在三维SMT电路板上自动装配和焊接组件

摘要

Circuit boards (7) are extracted from a supply magazine (15) by an industrial robot (13) holding the board in grippers (14). The robot arm is moved through an arc and passes beneath a solder paste dispenser (2) that is pneumatically powered and is coupled to a controller (12). Components (4) to be mounted on the board are extracted from a feed unit (9) with a linear slide mechanism (11). A CCD camera (5) monitors the position of the component being handled relative tot he board and a correction is applied to the robot to ensure correct alignment for insertion onto the board. The components are soldered into place by passing under a laser soldering tool (6, 7).
机译:通过工业机器人(13)将电路板(7)固定在夹具(14)中,从供应盒(15)中取出电路板(7)。机械臂沿弧线移动并经过焊膏分配器(2)下方,该焊膏分配器由气动驱动并与控制器(12)相连。利用线性滑动机构(11)从进给单元(9)中取出要安装在板上的组件(4)。 CCD摄像机(5)监视要处理的组件相对于板的位置,并对机器人进行了校正,以确保正确对齐以插入板中。通过在激光焊接工具(6,7)下通过将零件焊接到位。

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