首页> 外国专利> A method for the preparation of polymer surfaces for the subsequent metal plating, as well as improved produced therefrom against metal clad plastic articles.

A method for the preparation of polymer surfaces for the subsequent metal plating, as well as improved produced therefrom against metal clad plastic articles.

机译:一种用于随后的金属镀覆的聚合物表面的制备方法,以及由此改进的抗金属包覆塑料制品的生产方法。

摘要

Method of modifying an aromatic polymer surface to improve adhesion of a metal layer thereon and to the articles produced therefrom. The surface of the aromatic polymer such as polycarbonate, is nitrated by a contact with a nitrating solution such as a mixture of nitric and sulfuric acid and then hydroxylated by a contact with a hydroxylating solution such as ammonium hydroxide. The hydroxylated surface is thus chemically modified to become hydrophilic. The chemically modified surface is electrolessly plated with a primary metal layer. A secondary metal layer is then electrolessly or electrolytically applied on top of the primary metal layer until a metal layer of a desired thickness is attained. The present invention further discloses articles such as an EMI shielded enclosure or a printed circuit board having metal layers as an EMI shield or a conductive metal trace pattern respectively.
机译:修饰芳族聚合物表面以改善其上的金属层以及由此产生的制品的粘附性的方法。芳族聚合物如聚碳酸酯的表面通过与硝化溶液如硝酸和硫酸的混合物接触而被硝化,然后通过与羟基化溶液如氢氧化铵的接触而被羟基化。羟基化的表面因此被化学修饰为亲水性的。化学修饰的表面化学镀有一次金属层。然后,将第二金属层无电镀或电解地涂覆在第一金属层的顶部上,直到获得所需厚度的金属层。本发明进一步公开了诸如具有金属层分别作为EMI屏蔽层或导电金属走线图案的EMI屏蔽外壳或印刷电路板的制品。

著录项

  • 公开/公告号DE69112579T2

    专利类型

  • 公开/公告日1996-03-21

    原文格式PDF

  • 申请/专利权人 GEN ELECTRIC US;

    申请/专利号DE1991612579T

  • 发明设计人 ZARNOCH KENNETH PAUL US;

    申请日1991-09-25

  • 分类号C23C18/20;C08J7/12;

  • 国家 DE

  • 入库时间 2022-08-22 03:41:32

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